Invention Grant
- Patent Title: Testing of integrated circuits using test module
- Patent Title (中): 使用测试模块测试集成电路
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Application No.: US12136035Application Date: 2008-06-09
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Publication No.: US07941722B2Publication Date: 2011-05-10
- Inventor: Pascal Cussonneau , Eric Bernillon
- Applicant: Pascal Cussonneau , Eric Bernillon
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neeringe; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G06F11/00
- IPC: G06F11/00

Abstract:
A method and apparatus for testing of integrated circuits using a Direct Memory Load Execute Dump (DMLED) test module. The method includes loading a test case into a memory using the DMLED test module, loading initialization signatures of fixed pattern into the memory using the DMLED test module, and executing the test case at an operating clock rate of a processor. The method further includes writing result signatures into the memory, and dumping the results signatures from the memory to a tester using the DMLED test module.
Public/Granted literature
- US20080320347A1 Testing of Integrated Circuits Using Test Module Public/Granted day:2008-12-25
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