Invention Grant
US07943859B2 Circuit board, its manufacturing method, and joint box using circuit board
有权
电路板,其制造方法和接线盒使用电路板
- Patent Title: Circuit board, its manufacturing method, and joint box using circuit board
- Patent Title (中): 电路板,其制造方法和接线盒使用电路板
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Application No.: US10593796Application Date: 2005-03-29
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Publication No.: US07943859B2Publication Date: 2011-05-17
- Inventor: Tsugio Ambo , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- Applicant: Tsugio Ambo , Satoru Fujiwara , Yoshikatsu Hasegawa , Chihiro Nakagawa , Takeshi Ono , Atsushi Urushidani , Tooru Kashioka , Katsuji Shimazawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Cable Industries, Ltd.
- Current Assignee: Mitsubishi Cable Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2004-105997 20040331; JP2004-239707 20040819; JP2004-381266 20041228
- International Application: PCT/JP2005/005811 WO 20050329
- International Announcement: WO2005/096683 WO 20051013
- Main IPC: H01R12/04
- IPC: H01R12/04

Abstract:
A circuit board with a simple structure is manufactured. A circuit board 19 has thereon a foil circuit 21 provided on a synthetic resin plate 20 formed by injection molding, made of a copper foil, and having a pattern different for circuit board 19. Anchor pins 20a projecting upward are provided on the resin plate 20 and passed through pinholes made in the foil circuit 21. The foil circuit 21 are positioned and secured to the resin plate 20. In a required portion of the resin plate 20, a terminal insertion hole 20c is provided, and receiving terminal 22 is secured to the required portion of the terminal insertion hole 20c and connected to the foil circuit 21.
Public/Granted literature
- US20070218257A1 CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD Public/Granted day:2007-09-20
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