Invention Grant
- Patent Title: Copper alloy for electronic machinery and tools and method of producing the same
- Patent Title (中): 电子机械用铜合金及其制造方法
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Application No.: US11478292Application Date: 2006-06-30
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Publication No.: US07946022B2Publication Date: 2011-05-24
- Inventor: Takeo Uno , Chikahito Sugahara , Kuniteru Mihara
- Applicant: Takeo Uno , Chikahito Sugahara , Kuniteru Mihara
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-195720 20050705
- Main IPC: C22F1/08
- IPC: C22F1/08 ; B21B15/00 ; B22D27/20
Abstract:
A copper alloy for electronic machinery and tools, having a surface layer of a work affected layer whose thickness is 0.2 μm or below; and a method of producing the same.
Public/Granted literature
- US20070015001A1 Copper alloy for electronic machinery and tools and method of producing the same Public/Granted day:2007-01-18
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