Invention Grant
- Patent Title: Three-dimensional microprobe array
- Patent Title (中): 三维微探针阵列
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Application No.: US12128804Application Date: 2008-05-29
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Publication No.: US07946050B2Publication Date: 2011-05-24
- Inventor: Jin-Chern Chiou , Chih-Wei Chang
- Applicant: Jin-Chern Chiou , Chih-Wei Chang
- Applicant Address: TW Hsinchu
- Assignee: National Chiao Tung University
- Current Assignee: National Chiao Tung University
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW96142516A 20071109
- Main IPC: G01D13/00
- IPC: G01D13/00 ; G01R31/00
Abstract:
The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.
Public/Granted literature
- US20090120216A1 THREE-DIMENSIONAL MICROPROBE ARRAY Public/Granted day:2009-05-14
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