Invention Grant
- Patent Title: Coating layer thickness measurement mechanism and coating layer forming apparatus using the same
- Patent Title (中): 涂层厚度测量机构和使用其的涂层形成装置
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Application No.: US11797796Application Date: 2007-05-08
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Publication No.: US07946247B2Publication Date: 2011-05-24
- Inventor: Hideaki Awata , Katsuji Emura , Kentaro Yoshida
- Applicant: Hideaki Awata , Katsuji Emura , Kentaro Yoshida
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-130924 20060510
- Main IPC: B05C5/02
- IPC: B05C5/02

Abstract:
In a measurement mechanism for continuously measuring a thickness of a coating layer, provided in an apparatus for forming the coating layer on a conductive elongate base material in a coating treatment base station while the base material is fed, a sensing portion for measuring a capacitance value of the coating layer is arranged before and after the base station, and tension applied to the base material at the sensing portion is set to be greater than tension applied to the base material at the base station. Thus, in forming the coating layer on the elongate base material while the base material is continuously fed, variation in a feeding speed is suppressed, influence of sway of a measurement surface in a direction of thickness at the thickness sensing portion during feeding is minimized, and a thickness of the coating layer can be measured with higher accuracy.
Public/Granted literature
- US20070261638A1 Coating layer thickness measurement mechanism and coating layer forming apparatus using the same Public/Granted day:2007-11-15
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