Invention Grant
US07946465B2 Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
有权
Wirebonder在集成电路管芯和印刷电路板之间形成薄型线材
- Patent Title: Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
- Patent Title (中): Wirebonder在集成电路管芯和印刷电路板之间形成薄型线材
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Application No.: US12046452Application Date: 2008-03-12
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Publication No.: US07946465B2Publication Date: 2011-05-24
- Inventor: Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant: Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such that they have a flatter profile shape.
Public/Granted literature
- US20090078740A1 WIREBONDER FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUITS DIES AND PRINTED CIRCUIT BOARDS Public/Granted day:2009-03-26
Information query
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