Invention Grant
- Patent Title: Offset closure mechanism for a reclosable pouch
- Patent Title (中): 用于可重新封闭的袋子的偏移闭合机构
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Application No.: US11818586Application Date: 2007-06-15
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Publication No.: US07946766B2Publication Date: 2011-05-24
- Inventor: Brian C. Dais , Robert R. Turvey , James C. Pawloski , Bryan L. Ackerman , Daniel P. Zimmerman
- Applicant: Brian C. Dais , Robert R. Turvey , James C. Pawloski , Bryan L. Ackerman , Daniel P. Zimmerman
- Applicant Address: US WI Racine
- Assignee: S.C. Johnson & Son, Inc.
- Current Assignee: S.C. Johnson & Son, Inc.
- Current Assignee Address: US WI Racine
- Main IPC: B65D33/16
- IPC: B65D33/16 ; B65D33/01 ; A44B19/00

Abstract:
An offset resealable closure mechanism adapted to provide an airtight seal for a pouch includes a first elongate closure element and a second elongate closure element. The first elongate closure element includes a first elongate closure profile extending therefrom and a second elongate closure element includes first and second legs extending therefrom to define a channel. A sealing flange extends across the channel and includes a slit therethrough adapted to receive the first elongate closure profile. The sealing flange forms an airtight seal with the first elongate closure profile when the closure mechanism is occluded.
Public/Granted literature
- US20080310771A1 Offset closure mechanism for a reclosable pouch Public/Granted day:2008-12-18
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