Invention Grant
- Patent Title: Circuit interface device
- Patent Title (中): 电路接口设备
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Application No.: US12585720Application Date: 2009-09-23
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Publication No.: US07946857B2Publication Date: 2011-05-24
- Inventor: Wei Chung Wang
- Applicant: Wei Chung Wang
- Applicant Address: TW San Chung, Taipei
- Assignee: Kye Systems Corp.
- Current Assignee: Kye Systems Corp.
- Current Assignee Address: TW San Chung, Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW98112566A 20090415
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A circuit interface device is presented. A circuit board is secured by a circuit board cover, a plurality of electrical contacts is disposed on the circuit board, and a connector cover is coupled to a front end of the circuit board, such that a socket disposed at one end of the connector cover is corresponding to an upper side of the electrical contacts of the circuit board, thereby forming a connector of the circuit interface device. As such, through a structural design of buckling the connector cover on the circuit board without completely covering the connector cover on outer edge of the circuit board, a thickness of the connector cover covering the circuit board cover is reduced.
Public/Granted literature
- US20100267285A1 Circuit interface device Public/Granted day:2010-10-21
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