Invention Grant
- Patent Title: Connector pick-up cover
- Patent Title (中): 连接器拾取盖
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Application No.: US12830271Application Date: 2010-07-02
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Publication No.: US07946865B1Publication Date: 2011-05-24
- Inventor: Ming-Chun Lai
- Applicant: Ming-Chun Lai
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Cheng UEI Precision Industry Co., Ltd.
- Current Assignee: Cheng UEI Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Cheng-Ju Chiang
- Main IPC: H01R13/44
- IPC: H01R13/44

Abstract:
A pick-up cover adapted to be mounted to a connector which includes an L-shaped insulating body with a base body and a prop body perpendicularly extending upward, includes a pick-up board mounted on the connector, two clipping boards extending downward from two opposite ends of the pick-up board to clip the insulating body therebetween, and prop boards protruding downward from a front of a bottom surface of the pick-up board and abutting on the base body to strengthen the pick-up board. The pick-up board has a flat top surface for the convenience of the pick-up cover being picked up by a SMT machine. A bottom edge of the clipping board protrudes inward to form a locating barb buckled in an end outside of the base body. A locating portion protrudes at an inside of the clipping board and abuts against an end of a rear surface of the prop body.
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