Invention Grant
US07947098B2 Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
有权
具有降低的气体夹杂物缺陷的化学机械抛光垫抛光层的制造方法
- Patent Title: Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
- Patent Title (中): 具有降低的气体夹杂物缺陷的化学机械抛光垫抛光层的制造方法
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Application No.: US12490009Application Date: 2009-06-23
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Publication No.: US07947098B2Publication Date: 2011-05-24
- Inventor: John Esbenshade , Andrew M Geiger , Paul Libbers , Samuel J November , Paul J Sacchetti , Jonathan Tracy , David Verbaro , Michael E Watkins
- Applicant: John Esbenshade , Andrew M Geiger , Paul Libbers , Samuel J November , Paul J Sacchetti , Jonathan Tracy , David Verbaro , Michael E Watkins
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: C09K3/14
- IPC: C09K3/14
Abstract:
A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.
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