Invention Grant
- Patent Title: Honeycomb structure and method for producing same
- Patent Title (中): 蜂窝结构及其制造方法
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Application No.: US12235312Application Date: 2008-09-22
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Publication No.: US07947103B2Publication Date: 2011-05-24
- Inventor: Naoshi Masukawa , Atsushi Watanabe , Shuichi Ichikawa
- Applicant: Naoshi Masukawa , Atsushi Watanabe , Shuichi Ichikawa
- Applicant Address: JP Nagoya
- Assignee: MGK Insulators, Ltd.
- Current Assignee: MGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-087263 20060328
- Main IPC: B01D39/14
- IPC: B01D39/14 ; B01D39/06 ; B32B3/12
Abstract:
Disclosed is a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of a layered clay mineral. Also disclosed are a honeycomb structure which is bonded with a bonding material containing 0.1 to 10 mass % of an organic binder, and a honeycomb structure which is bonded with a bonding material having a Casson yield value of 6 Pa or more. Further disclosed is a method for producing such a honeycomb structure.
Public/Granted literature
- US20090029105A1 HONEYCOMB STRUCTURE AND METHOD FOR PRODUCING SAME Public/Granted day:2009-01-29
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