Invention Grant
- Patent Title: Copper alloy strip material for electrical/electronic equipment and process for producing the same
- Patent Title (中): 用于电气/电子设备的铜合金带材及其制造方法
-
Application No.: US12310910Application Date: 2007-09-12
-
Publication No.: US07947133B2Publication Date: 2011-05-24
- Inventor: Kuniteru Mihara , Tatsuhiko Eguchi
- Applicant: Kuniteru Mihara , Tatsuhiko Eguchi
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kubotera & Associates LLC
- Priority: JP2006-246961 20060912; JP2007-236003 20070911
- International Application: PCT/JP2007/067730 WO 20070912
- International Announcement: WO2008/032738 WO 20080320
- Main IPC: C22C9/06
- IPC: C22C9/06 ; C22F1/08

Abstract:
A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 μm to 2 μm, the intermetallic compound B has a compound diameter of 0.05 μm to less than 0.3 μm, and the intermetallic compound C has a compound diameter of more than 0.001 μm to less than 0.05 μm.
Public/Granted literature
- US20090257909A1 Copper alloy strip material for electrical/electronic equipment and process for producing the same Public/Granted day:2009-10-15
Information query