Invention Grant
- Patent Title: Dry adhesion bonding
- Patent Title (中): 干粘连接
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Application No.: US11756890Application Date: 2007-06-01
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Publication No.: US07947148B2Publication Date: 2011-05-24
- Inventor: Joerg Lahann , Hsien-Yeh Chen
- Applicant: Joerg Lahann , Hsien-Yeh Chen
- Applicant Address: US MI Ann Arbor
- Assignee: The Regents of the University of Michigan
- Current Assignee: The Regents of the University of Michigan
- Current Assignee Address: US MI Ann Arbor
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B32B5/00
- IPC: B32B5/00

Abstract:
Methods for bonding include deposition an adhesion layer on at least one substrate using chemical vapor deposition. The two adhesion layers each have a reactive group that is complementary to the other, thus enabling strong adhesion between the bonded substrates. Devices include two substrates that can be adhered together by chemically depositing an adhesion layer on at least one substrate using chemical vapor deposition. The substrates each have a reactive group that is complementary to the other, thus enabling strong adhesion between the bonded substrates.
Public/Granted literature
- US20070281126A1 DRY ADHESION BONDING Public/Granted day:2007-12-06
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