Invention Grant
US07947157B2 Apparatus and method for depositing and planarizing thin films of semiconductor wafers
失效
用于沉积和平坦化半导体晶片的薄膜的装置和方法
- Patent Title: Apparatus and method for depositing and planarizing thin films of semiconductor wafers
- Patent Title (中): 用于沉积和平坦化半导体晶片的薄膜的装置和方法
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Application No.: US11494997Application Date: 2006-07-28
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Publication No.: US07947157B2Publication Date: 2011-05-24
- Inventor: Mike Ravkin , John Boyd , Yezdi N. Dordi , Fred C. Redeker , John M. de Larios
- Applicant: Mike Ravkin , John Boyd , Yezdi N. Dordi , Fred C. Redeker , John M. de Larios
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella LLP.
- Main IPC: C25D5/06
- IPC: C25D5/06 ; C25D5/04 ; C25D17/14 ; C25D17/12 ; C25D7/12
Abstract:
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
Public/Granted literature
- US20060260932A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers Public/Granted day:2006-11-23
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