Invention Grant
US07947161B2 Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
有权
操作具有流体动力学的电镀电池的方法促进在具有通孔的工件上更均匀的沉积
- Patent Title: Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
- Patent Title (中): 操作具有流体动力学的电镀电池的方法促进在具有通孔的工件上更均匀的沉积
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Application No.: US11836903Application Date: 2007-08-10
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Publication No.: US07947161B2Publication Date: 2011-05-24
- Inventor: Lawrence E. Gebhart , E. Jennings Taylor
- Applicant: Lawrence E. Gebhart , E. Jennings Taylor
- Applicant Address: US OH Clayton
- Assignee: Faraday Technology, Inc.
- Current Assignee: Faraday Technology, Inc.
- Current Assignee Address: US OH Clayton
- Agency: Thompson Hine LLP
- Main IPC: C25D5/08
- IPC: C25D5/08 ; C25D7/00 ; C25D21/10
Abstract:
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
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