Invention Grant
US07947332B2 Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
有权
印刷电路板用预浸料，金属箔复合层压板和印刷电路板，以及多层印刷电路板的制造方法
- Patent Title: Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
- Patent Title (中): 印刷电路板用预浸料，金属箔复合层压板和印刷电路板，以及多层印刷电路板的制造方法
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Application No.: US11630651Application Date: 2005-06-22
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Publication No.: US07947332B2Publication Date: 2011-05-24
- Inventor: Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
- Applicant: Nozomu Takano , Kazumasa Takeuchi , Katsuyuki Masuda , Masashi Tanaka , Kazuhito Obata , Yuuji Ooyama , Yoshitsugu Matsuura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-184856 20040623; JP2004184857 20040623; JP2004-184858 20040623; JP2004-189607 20040628
- International Application: PCT/JP2005/011449 WO 20050622
- International Announcement: WO2006/001305 WO 20060105
- Main IPC: B05D3/12
- IPC: B05D3/12
Abstract:
A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.
Public/Granted literature
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