Invention Grant
- Patent Title: Method of fabricating halftone phase shift mask
- Patent Title (中): 制造半色调相移掩模的方法
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Application No.: US12249935Application Date: 2008-10-12
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Publication No.: US07947414B2Publication Date: 2011-05-24
- Inventor: Eui-Sang Park
- Applicant: Eui-Sang Park
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2007-0106050 20071022
- Main IPC: G03F1/00
- IPC: G03F1/00 ; G03C5/00

Abstract:
A method of fabricating a halftone phase shift mask is disclosed, by which a process time and a failure ratio can be reduced by sequentially forming a phase shift layer a first photoresist, a metal layer and a second photoresist over a transparent substrate, performing a process to expose a portion of the metal layer, and then performing an etching process to expose a portion of the substrate using the second photoresist as a mask, and then performing an electron-beam exposure process on a portion of the first photoresist such that electrons contact the surface of the transparent substrate, and then simultaneously developing a portion of the first photoresist and removing a portion of the metal layer and a remaining portion of the first photoresist to expose a portion of the phase shift layer.
Public/Granted literature
- US20090104543A1 METHOD OF FABRICATING HALFTONE PHASE SHIFT MASK Public/Granted day:2009-04-23
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