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US07947515B2 Defect inspecting method 失效
缺陷检查方法

Defect inspecting method
Abstract:
A defect inspecting method includes: forming, in a first air pressure state, a film, which covers one opening of two openings provided on an upper surface of a substrate, on a tubular contact hole formed on the substrate in manufacturing a semiconductor device and formed in a tubular shape by connecting two cylindrical contact holes on bottom surface sides thereof, both ends of the tubular shape being opened in the openings; exposing the substrate covered with the film in a second air pressure state; and observing whether the film is deformed to thereby inspect whether the part of the tubular shape is blocked.
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