Invention Grant
US07947546B2 Implant damage control by in-situ C doping during SiGe epitaxy for device applications 有权
用于器件应用的SiGe外延期间原位C掺杂的植入物损伤控制

Implant damage control by in-situ C doping during SiGe epitaxy for device applications
Abstract:
Some example embodiments of the invention comprise methods for and semiconductor structures comprised of: a MOS transistor comprised of source/drain regions, a gate dielectric, a gate electrode, channel region; a carbon doped SiGe region that applies a stress on the channel region whereby the carbon doped SiGe region retains stress/strain on the channel region after subsequent heat processing.
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