Invention Grant
US07947546B2 Implant damage control by in-situ C doping during SiGe epitaxy for device applications
有权
用于器件应用的SiGe外延期间原位C掺杂的植入物损伤控制
- Patent Title: Implant damage control by in-situ C doping during SiGe epitaxy for device applications
- Patent Title (中): 用于器件应用的SiGe外延期间原位C掺杂的植入物损伤控制
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Application No.: US11502132Application Date: 2006-08-09
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Publication No.: US07947546B2Publication Date: 2011-05-24
- Inventor: Jin Ping Liu , Judson Robert Holt
- Applicant: Jin Ping Liu , Judson Robert Holt
- Applicant Address: SG Singapore US
- Assignee: Chartered Semiconductor Manufacturing, Ltd.,International Business Machines Corporation (IBM)
- Current Assignee: Chartered Semiconductor Manufacturing, Ltd.,International Business Machines Corporation (IBM)
- Current Assignee Address: SG Singapore US
- Agency: Horizon IP Pte Ltd
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Some example embodiments of the invention comprise methods for and semiconductor structures comprised of: a MOS transistor comprised of source/drain regions, a gate dielectric, a gate electrode, channel region; a carbon doped SiGe region that applies a stress on the channel region whereby the carbon doped SiGe region retains stress/strain on the channel region after subsequent heat processing.
Public/Granted literature
- US20070096149A1 Implant damage control by in-situ C doping during SiGe epitaxy for device applications Public/Granted day:2007-05-03
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