Invention Grant
- Patent Title: Hybrid semiconductor structure
- Patent Title (中): 混合半导体结构
-
Application No.: US12331675Application Date: 2008-12-10
-
Publication No.: US07947580B2Publication Date: 2011-05-24
- Inventor: Mikael T. Bjoerk , Oliver Hayden , Heike E. Riel , Walter Heinrich Riess , Heinz Schmid
- Applicant: Mikael T. Bjoerk , Oliver Hayden , Heike E. Riel , Walter Heinrich Riess , Heinz Schmid
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Gail H. Zarick
- Priority: EP07122904 20071211
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L21/00

Abstract:
A method for the fabrication of a semiconductor structure that includes areas that have different crystalline orientation and semiconductor structure formed thereby. The disclosed method allows fabrication of a semiconductor structure that has areas of different semiconducting materials. The method employs templated crystal growth using a Vapor-Liquid-Solid (VLS) growth process. A silicon semiconductor substrate having a first crystal orientation direction is etched to have an array of holes into its surface. A separation layer is formed on the inner surface of the hole for appropriate applications. A growth catalyst is placed at the bottom of the hole and a VLS crystal growth process is initiated to form a nanowire. The resultant nanowire crystal has a second different crystal orientation which is templated by the geometry of the hole.
Public/Granted literature
- US20090146133A1 HYBRID SEMICONDUCTOR STRUCTURE Public/Granted day:2009-06-11
Information query
IPC分类: