Invention Grant
- Patent Title: Composition for cleaning semiconductor device
- Patent Title (中): 用于清洁半导体器件的组合物
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Application No.: US12216212Application Date: 2008-07-01
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Publication No.: US07947638B2Publication Date: 2011-05-24
- Inventor: Atsushi Tamura , Yasuhiro Doi
- Applicant: Atsushi Tamura , Yasuhiro Doi
- Applicant Address: JP Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2003-427455 20031224
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A sulfur-containing detergent composition for cleaning a semiconductor device having an aluminum wire, wherein the sulfur-containing detergent composition is capable of forming a protective film containing a sulfur atom on a surface of an aluminum film in a protective film-forming test; a semiconductor device comprising a protective film containing a sulfur atom on a surface of an aluminum wire, wherein sulfur atom is contained within a region of at least 5 nm in its thickness direction from the surface of the protective film; and method for manufacturing a semiconductor device, comprising the step of contacting an aluminum wire of the semiconductor device with the sulfur-containing detergent composition as defined above, thereby forming a sulfur-containing protective film on the surface of the aluminum wire. The semiconductor device can be suitably used in the manufacture of electronic parts such as LCD, memory and CPU. Especially, the semiconductor device is suitably used in the manufacture of a highly integrated semiconductor with advanced scale-down.
Public/Granted literature
- US20080296767A1 Composition for cleaning semiconductor device Public/Granted day:2008-12-04
Information query
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