Invention Grant
- Patent Title: Moisture activated latent curing adhesive or sealant
- Patent Title (中): 水分活化的潜在固化胶或密封剂
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Application No.: US11501541Application Date: 2006-08-09
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Publication No.: US07947758B2Publication Date: 2011-05-24
- Inventor: Chetan Anirudh Khatri , Joseph Zavatsky , Binoy K. Bordoloi
- Applicant: Chetan Anirudh Khatri , Joseph Zavatsky , Binoy K. Bordoloi
- Applicant Address: US NJ Somerville
- Assignee: Ethicon, Inc.
- Current Assignee: Ethicon, Inc.
- Current Assignee Address: US NJ Somerville
- Agent David R. Crichton
- Main IPC: C09J139/00
- IPC: C09J139/00 ; C09J133/14 ; A61L27/14
Abstract:
The invention relates to a novel poly(ethylene oxide)imine; a novel amine reactive moiety; a novel moisture activated latent curing adhesive or sealant mixture comprising (1) a ketimine or aldimine, and (2) an amine reactive moiety; and a novel moisture activated latent curing adhesive or sealant comprising the reaction product of (1) and (2).
Public/Granted literature
- US20080039547A1 Moisture activated latent curing adhesive or sealant Public/Granted day:2008-02-14
Information query
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