Invention Grant
- Patent Title: Resin compact, casing and production method of resin compact
- Patent Title (中): 树脂紧凑，外壳和树脂紧凑的生产方法
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Application No.: US11898330Application Date: 2007-09-11
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Publication No.: US07947780B2Publication Date: 2011-05-24
- Inventor: Makiko Yamanaka , Ryuichiro Maeyama
- Applicant: Makiko Yamanaka , Ryuichiro Maeyama
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-024488 20070202
- Main IPC: C08L67/02
- IPC: C08L67/02
Abstract:
A resin compact includes two or more kinds of resins, wherein when a Charpy impact strength in a resin flow direction at shaping is SMD and a Charpy impact strength in a direction crossing the resin flow direction at shaping is STD, SMD/STD is from 3.5 to 5.0.
Public/Granted literature
- US20080188620A1 Resin compact, casing and production method of resin compact Public/Granted day:2008-08-07
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