Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US12353414Application Date: 2009-01-14
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Publication No.: US07947902B2Publication Date: 2011-05-24
- Inventor: Zi-Ming Tang
- Applicant: Zi-Ming Tang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Clifford O. Chi
- Priority: CN200810304878 20081010
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An electronic device enclosure includes a housing and a cover fixed on the housing. The housing defines a first latching portion, and the cover defines a plurality of first latching hooks to engage with the first latching portion. The electronic device enclosure further includes an urging assembly rotatably assembled in the housing to contact the first latching hooks, and an operating member positioned in the housing and contacting the urging assembly. The operating member is capable of pushing the urging assembly to rotate so that the first latching hooks bends and disengages from the first latching portion.
Public/Granted literature
- US20100089604A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2010-04-15
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