Disclosed is a light module package including a mounting substrate for mounting and electrically contacting at least one light emitting diode and a ceramic layer disposed in a path of light emitted by the light emitting diode. The ceramic layer includes a wavelength converting material and the light emitting diode is disposed between the ceramic layer and the mounting substrate. The light module package also includes a light sensor disposed at the mounting substrate for detecting a luminous output of the light emitting diode in order to control the brightness and/or the color of the light leaving the light module. The ceramic layer is only partly translucent to shield the light sensor against ambient light.