Provided are apparatuses for processing a surface of a substrate using direct and recycled radiation reflected from the substrate. The apparatus includes a radiation source positioned to direct a radiation beam toward a beam image forming system that forms a beam image on the substrate surface and a recycling system. The recycling system collects radiation reflected from the substrate surface and redirects it back toward the beam image on the substrate in a +1× manner. As a result, radiation incident on and reflected from the substrate is recycled through multiple cycles. This improves the uniformity of the radiation absorbed by the substrate in instances where the thin film patterns on the substrate would otherwise result in non-uniform absorption and uneven heating. Exemplary recycling systems suitable for use with the invention include Offner and Dyson relay systems as well as variants thereof.