Invention Grant
US07948009B2 Nitride semiconductor epitaxial wafer and nitride semiconductor device
有权
氮化物半导体外延晶片和氮化物半导体器件
- Patent Title: Nitride semiconductor epitaxial wafer and nitride semiconductor device
- Patent Title (中): 氮化物半导体外延晶片和氮化物半导体器件
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Application No.: US12382481Application Date: 2009-03-17
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Publication No.: US07948009B2Publication Date: 2011-05-24
- Inventor: Yoshihiko Moriya , Takeshi Tanaka , Yohei Otoki , Masae Sahara
- Applicant: Yoshihiko Moriya , Takeshi Tanaka , Yohei Otoki , Masae Sahara
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-069133 20080318
- Main IPC: H01L31/072
- IPC: H01L31/072 ; H01L31/109 ; H01L31/0328 ; H01L31/0336

Abstract:
A nitride semiconductor epitaxial wafer includes a growth substrate including a surface for growing a nitride semiconductor thereon, a first structure layer formed on the growth substrate, a dislocation propagation direction changing layer formed on the first structure layer for changing a propagation direction of a dislocation propagated in the first structure layer into a lateral direction, a second structure layer formed on the dislocation propagation direction changing layer, and a buffer layer formed on the second structure layer for changing a propagation direction of a dislocation propagated in the second structure layer.
Public/Granted literature
- US20090236634A1 Nitride semiconductor epitaxial wafer and nitride semiconductor device Public/Granted day:2009-09-24
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