Invention Grant
- Patent Title: Digital radiography imager with buried interconnect layer in silicon-on-glass and method of fabricating same
- Patent Title (中): 具有硅玻璃中的埋置互连层的数字射线成像仪及其制造方法
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Application No.: US12487678Application Date: 2009-06-19
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Publication No.: US07948017B2Publication Date: 2011-05-24
- Inventor: Timothy J. Tredwell , Jackson Lai
- Applicant: Timothy J. Tredwell , Jackson Lai
- Applicant Address: US NY Rochester
- Assignee: Carestream Health, Inc.
- Current Assignee: Carestream Health, Inc.
- Current Assignee Address: US NY Rochester
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113

Abstract:
A method of forming an imaging array includes providing a single crystal silicon substrate having an internal separation layer, forming a patterned conductive layer proximate a first side of the single crystal silicon substrate, forming an electrically conductive layer on the first side of the single crystal silicon substrate and in communication with the patterned conductive layer, securing the single crystal silicon substrate having the patterned conductive layer and electrically conductive layer formed thereon to a glass substrate with the first side of the single crystal silicon substrate proximate the glass substrate, separating the single crystal silicon substrate at the internal separation layer to create an exposed surface opposite the first side of the single crystal silicon substrate and forming an array comprising a plurality of photosensitive elements and readout elements on the exposed surface.
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Information query
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