Invention Grant
US07948031B2 Semiconductor device and method of fabricating semiconductor device
有权
半导体器件及半导体器件的制造方法
- Patent Title: Semiconductor device and method of fabricating semiconductor device
- Patent Title (中): 半导体器件及半导体器件的制造方法
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Application No.: US12167764Application Date: 2008-07-03
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Publication No.: US07948031B2Publication Date: 2011-05-24
- Inventor: Seiji Otake , Yasuhiro Takeda , Kenichi Maki
- Applicant: Seiji Otake , Yasuhiro Takeda , Kenichi Maki
- Applicant Address: JP Osaka JP Gunma
- Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee Address: JP Osaka JP Gunma
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-175548 20070703; JP2007-179693 20070709
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a gate electrode formed through an insulating film in a groove having a first side surface adjacent to a source region and a base region, and a second conductive type first impurity region formed adjacent to a second side surface of the groove between the groove and a lead-out portion of a drain region existing below the base region so as to extend downward beyond a lower end of the groove.
Public/Granted literature
- US20090014790A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2009-01-15
Information query
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