Invention Grant
US07948036B2 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
有权
I / O和功率ESD保护电路,通过增强深亚微米CMOS工艺中的衬底偏置
- Patent Title: I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
- Patent Title (中): I / O和功率ESD保护电路,通过增强深亚微米CMOS工艺中的衬底偏置
-
Application No.: US12506746Application Date: 2009-07-21
-
Publication No.: US07948036B2Publication Date: 2011-05-24
- Inventor: Jau-Wen Chen
- Applicant: Jau-Wen Chen
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Clark Hill PLC
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A technique to enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.
Public/Granted literature
- US20090294856A1 I/O AND POWER ESD PROTECTION CIRCUITS BY ENHANCING SUBSTRATE-BIAS IN DEEP-SUBMICRON CMOS PROCESS Public/Granted day:2009-12-03
Information query
IPC分类: