Invention Grant
US07948036B2 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process 有权
I / O和功率ESD保护电路,通过增强深亚微米CMOS工艺中的衬底偏置

  • Patent Title: I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
  • Patent Title (中): I / O和功率ESD保护电路,通过增强深亚微米CMOS工艺中的衬底偏置
  • Application No.: US12506746
    Application Date: 2009-07-21
  • Publication No.: US07948036B2
    Publication Date: 2011-05-24
  • Inventor: Jau-Wen Chen
  • Applicant: Jau-Wen Chen
  • Applicant Address: US CA Milpitas
  • Assignee: LSI Corporation
  • Current Assignee: LSI Corporation
  • Current Assignee Address: US CA Milpitas
  • Agency: Clark Hill PLC
  • Main IPC: H01L23/62
  • IPC: H01L23/62
I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
Abstract:
A technique to enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.
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