Invention Grant
US07948065B1 Integrated circuit having increased radiation hardness and reliability
有权
集成电路具有增加的辐射硬度和可靠性
- Patent Title: Integrated circuit having increased radiation hardness and reliability
- Patent Title (中): 集成电路具有增加的辐射硬度和可靠性
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Application No.: US12590505Application Date: 2009-11-09
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Publication No.: US07948065B1Publication Date: 2011-05-24
- Inventor: Michael C. Maher
- Applicant: Michael C. Maher
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/552
- IPC: H01L23/552

Abstract:
A system and method is disclosed for providing an integrated circuit that has increased radiation hardness and reliability. A device active area of an integrated circuit is provided and a layer of radiation resistant material is applied to the device active area of the integrated circuit. In one advantageous embodiment the radiation resistant material is silicon carbide. In another advantageous embodiment a passivation layer is placed between the device active area and the layer of radiation resistant material. The integrated circuit of the present invention exhibits minimal sensitivity to (1) enhanced low dose rate sensitivity (ELDRS) effects of radiation, and (2) pre-irradiation elevated temperature stress (PETS) effects of radiation.
Information query
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