In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.