Invention Grant
US07948090B2 Capillary-flow underfill compositions, packages containing same, and systems containing same
有权
毛细管底部填充组合物，含有它们的包装和含有它们的体系
- Patent Title: Capillary-flow underfill compositions, packages containing same, and systems containing same
- Patent Title (中): 毛细管底部填充组合物，含有它们的包装和含有它们的体系
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Application No.: US11613805Application Date: 2006-12-20
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Publication No.: US07948090B2Publication Date: 2011-05-24
- Inventor: Rahul N. Manepalli , Saikumar Jayaraman
- Applicant: Rahul N. Manepalli , Saikumar Jayaraman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/48
- IPC: H01L23/48 ; B32B27/38 ; C08L61/00
Abstract:
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.
Public/Granted literature
- US20080150170A1 CAPILLARY-FLOW UNDERFILL COMPOSITIONS, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME Public/Granted day:2008-06-26
Information query
IPC分类:
