Semiconductor package and method of making the same

Invention Grant

US07948095B2 Semiconductor package and method of making the same 有权

Title translation: 半导体封装及其制作方法

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Patent Title: Semiconductor package and method of making the same
Patent Title (中): 半导体封装及其制作方法
Application No.: US12369429

Application Date: 2009-02-11
Publication No.: US07948095B2

Publication Date: 2011-05-24
Inventor: Catherine Bee Liang Ng , Chin Hock Toh , Anthony Yi-Sheng Sun
Applicant: Catherine Bee Liang Ng , Chin Hock Toh , Anthony Yi-Sheng Sun
Applicant Address: SG Singapore
Assignee: United Test and Assembly Center Ltd.
Current Assignee: United Test and Assembly Center Ltd.
Current Assignee Address: SG Singapore
Agency: Sughrue Mion, PLLC
Main IPC: H01L23/48
IPC: H01L23/48 ; H01L23/52

Semiconductor package and method of making the same

Abstract:

The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly processes.

Abstract(Chinese):

本发明涉及包括彼此垂直堆叠的两个或更多个管芯的半导体器件，以及制造半导体器件的方法。该方法可以包括晶片级通过硅互连制造和晶片级组装工艺的组合。

Public/Granted literature

US20090200662A1 SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME Public/Granted day:2009-08-13

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置