Invention Grant
- Patent Title: Integrated circuit and integrated circuit package
- Patent Title (中): 集成电路和集成电路封装
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Application No.: US11665059Application Date: 2005-10-28
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Publication No.: US07948242B2Publication Date: 2011-05-24
- Inventor: Masahiro Ishii , Toshiroh Nishio
- Applicant: Masahiro Ishii , Toshiroh Nishio
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack L.L.P.
- Priority: JP2004-320202 20041104
- International Application: PCT/JP2005/019861 WO 20051028
- International Announcement: WO2006/049090 WO 20060511
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
An integrated circuit includes a monitoring-target circuit portion 1200 and a debugging circuit portion 1100. The debugging circuit portion 1100 acquires a signal on a signal line of the monitoring-target circuit portion 1200 and transmits the acquired signal to an external device 2000 by radio. The debugging circuit portion 1100 includes a setting unit 1120 and a radio transmitter 1140. In order to monitor the monitoring-target circuit portion 1200, the setting unit 1120 sets an isolation unit 1300 so as to make electrical connection between the debugging circuit portion 1100 and the monitoring-target circuit portion 1200. In addition, the setting unit 1120 sets a selector 1130 to select a signal line 1131 specified as a monitoring target. The radio transmitter 1140 acquires a signal on the signal line selected by the selector 1130 and transmits the acquired signal to the external device 2000 by radio.
Public/Granted literature
- US20090027058A1 Integrated circuit and integrated circuit package Public/Granted day:2009-01-29
Information query