Invention Grant
- Patent Title: Dielectric film and layer testing
- Patent Title (中): 电介质膜和层测试
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Application No.: US12898268Application Date: 2010-10-05
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Publication No.: US07948259B2Publication Date: 2011-05-24
- Inventor: Andreas Martin , Karl-Henrik Rydén , Andrea Mitchell
- Applicant: Andreas Martin , Karl-Henrik Rydén , Andrea Mitchell
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/26
Abstract:
A system for testing and a method for making a semiconductor device is disclosed. A preferred embodiment includes a conductor overlying a dielectric layer. The conductor is coupled to a first test pad via a first conducting line and to a second test pad via a second conducting line.
Public/Granted literature
- US20110037490A1 Dielectric Film and Layer Testing Public/Granted day:2011-02-17
Information query
