Invention Grant
US07948317B2 Power amplifier integrated circuit with compensation mechanism for temperature and output power 有权
功率放大器集成电路,具有温度和输出功率补偿机制

  • Patent Title: Power amplifier integrated circuit with compensation mechanism for temperature and output power
  • Patent Title (中): 功率放大器集成电路,具有温度和输出功率补偿机制
  • Application No.: US12619684
    Application Date: 2009-11-17
  • Publication No.: US07948317B2
    Publication Date: 2011-05-24
  • Inventor: Kuang-Lieh Wan
  • Applicant: Kuang-Lieh Wan
  • Applicant Address: TW Taipei
  • Assignee: RichWave Technology Corp.
  • Current Assignee: RichWave Technology Corp.
  • Current Assignee Address: TW Taipei
  • Agent Winston Hsu; Scott Margo
  • Priority: TW98118173A 20090602
  • Main IPC: H03F3/21
  • IPC: H03F3/21
Power amplifier integrated circuit with compensation mechanism for temperature and output power
Abstract:
A power amplifier integrated circuit, which generates an RF output signal by amplifying an RF input signal, includes a thermal-sensing circuit, a feedback circuit, a logic judging circuit, an adjusting circuit, and an amplifying circuit. The thermal-sensing circuit generates a thermal sensing signal according to the operational temperature, and the feedback circuit generates a power compensation circuit according to power variations in the RF output signal. The logic judging circuit outputs a compensation signal according to the thermal sensing signal and the power compensation signal. The adjusting circuit adjusts the level of the RF input signal according to the compensation signal, thereby generating a corresponding 1st stage RF signal. The amplifying circuit can amplify the 1st stage RF signal, thereby generating the corresponding RF output signal.
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