Invention Grant
US07948764B2 Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
有权
将电子部件安装在优选软支撑上的方法，以及所得到的电子实体，例如护照
- Patent Title: Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
- Patent Title (中): 将电子部件安装在优选软支撑上的方法，以及所得到的电子实体，例如护照
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Application No.: US11663555Application Date: 2005-09-13
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Publication No.: US07948764B2Publication Date: 2011-05-24
- Inventor: Guy Enouf , Xavier Borde , Florian Demaimay
- Applicant: Guy Enouf , Xavier Borde , Florian Demaimay
- Applicant Address: FR Levallois-Perret
- Assignee: Oberthur Technologies
- Current Assignee: Oberthur Technologies
- Current Assignee Address: FR Levallois-Perret
- Agency: Young & Thompson
- Priority: FR0410146 20040924
- International Application: PCT/FR2005/002266 WO 20050913
- International Announcement: WO2006/035128 WO 20060406
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.
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