Invention Grant
- Patent Title: Heating configuration for use in thermal processing chambers
- Patent Title (中): 加热配置用于热处理室
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Application No.: US11853414Application Date: 2007-09-11
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Publication No.: US07949237B2Publication Date: 2011-05-24
- Inventor: Zion Koren , Conor Patrick O'Carroll , Shuen Chun Choy , Paul Janis Timans , Rudy Santo Tomas Cardema , James Tsuneo Taoka , Arieh A. Strod
- Applicant: Zion Koren , Conor Patrick O'Carroll , Shuen Chun Choy , Paul Janis Timans , Rudy Santo Tomas Cardema , James Tsuneo Taoka , Arieh A. Strod
- Applicant Address: US CA Fremont
- Assignee: Mattson Technology, Inc.
- Current Assignee: Mattson Technology, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Dority & Manning, P.A.
- Main IPC: A21B2/00
- IPC: A21B2/00 ; F26B3/30 ; C23C16/00
Abstract:
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
Public/Granted literature
- US20070297775A1 Heating Configuration for Use in Thermal Processing Chambers Public/Granted day:2007-12-27
Information query
