Invention Grant
- Patent Title: Solder ball landpad design to improve laminate performance
- Patent Title (中): 焊球贴垫设计，提高层压板性能
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Application No.: US10421079Application Date: 2003-04-23
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Publication No.: US07951646B2Publication Date: 2011-05-31
- Inventor: Brad D. Rumsey , Patrick W. Tandy , Willam J. Reeder , Stephen F. Moxham , Steven G. Thummel , Dana A. Stoddard , Joseph C. Young
- Applicant: Brad D. Rumsey , Patrick W. Tandy , Willam J. Reeder , Stephen F. Moxham , Steven G. Thummel , Dana A. Stoddard , Joseph C. Young
- Applicant Address: US NY Mt. Kisco
- Assignee: Round Rock Research, LLC
- Current Assignee: Round Rock Research, LLC
- Current Assignee Address: US NY Mt. Kisco
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
Public/Granted literature
- US20030193089A1 Solder ball landpad design to improve laminate performance Public/Granted day:2003-10-16
Information query
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