Invention Grant
- Patent Title: Method for fabricating semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US11187958Application Date: 2005-07-25
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Publication No.: US07951679B2Publication Date: 2011-05-31
- Inventor: Koji Yoshida , Keita Takahashi , Fumihiko Noro , Masatoshi Arai , Nobuyoshi Takahashi
- Applicant: Koji Yoshida , Keita Takahashi , Fumihiko Noro , Masatoshi Arai , Nobuyoshi Takahashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2004-236714 20040816
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
First, on a semiconductor region of a first conductivity type, a trapping film is formed which stores information by accumulating charges. Then, the trapping film is formed with a plurality of openings, and impurity ions of a second conductivity type are implanted into the semiconductor region from the formed openings, thereby forming a plurality of diffused layers of the second conductivity type in portions of the semiconductor region located below the openings, respectively. An insulating film is formed to cover edges of the trapping film located toward the openings, and then the semiconductor region is subjected to a thermal process in an atmosphere containing oxygen to oxidize upper portions of the diffused layers. Thereby, insulating oxide films are formed in the upper portions of the diffused layers, respectively. Subsequently, a conductive film is formed over the trapping film including the edges thereof to form an electrode.
Public/Granted literature
- US20060035418A1 Method for fabricating semiconductor device Public/Granted day:2006-02-16
Information query
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