Invention Grant
US07952165B2 Heterojunction bipolar transistor (HBT) with self-aligned sub-lithographic metal-semiconductor alloy base contacts
有权
具有自对准亚光刻金属 - 半导体合金基底触点的异质结双极晶体管(HBT)
- Patent Title: Heterojunction bipolar transistor (HBT) with self-aligned sub-lithographic metal-semiconductor alloy base contacts
- Patent Title (中): 具有自对准亚光刻金属 - 半导体合金基底触点的异质结双极晶体管(HBT)
-
Application No.: US11621864Application Date: 2007-01-10
-
Publication No.: US07952165B2Publication Date: 2011-05-31
- Inventor: Guy M. Cohen , Francois Pagette
- Applicant: Guy M. Cohen , Francois Pagette
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L27/082
- IPC: H01L27/082

Abstract:
A heterojunction bipolar transistor structure with self-aligned sub-lithographic extrinsic base region including a self-aligned metal-semiconductor alloy and self-aligned metal contacts made to the base is disclosed. The lateral dimension of the extrinsic base region is defined by the footprint of a sacrificial spacer, and its thickness is controlled by selective epitaxy. A self-aligned semiconductor-metal alloy and self-aligned metal contacts are made to the extrinsic base using a method compatible with conventional silicon processing.
Public/Granted literature
Information query
IPC分类: