Invention Grant
- Patent Title: Hermetic packaging and method of manufacture and use therefore
- Patent Title (中): 因此密封包装及其制造和使用方法
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Application No.: US11113545Application Date: 2005-04-25
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Publication No.: US07952189B2Publication Date: 2011-05-31
- Inventor: Chang-Feng Wan
- Applicant: Chang-Feng Wan
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
An embodiment of the present invention provides a method of manufacturing hermetic packaging for devices on a substrate wafer, comprising forming a plurality of adhesive rings on a cap wafer or the substrate wafer, bonding the cap wafer to the substrate wafer with an adhesive layer, forming trenches in the cap wafer and the adhesive rings along outer rim of the adhesive rings, and covering sidewall of the trenches by at least one deposited film to provide a diffusion barrier to moisture or gas.
Public/Granted literature
- US20050263866A1 Hermetic pacakging and method of manufacture and use therefore Public/Granted day:2005-12-01
Information query
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