Invention Grant
- Patent Title: Fabrication of microelectronic devices
- Patent Title (中): 微电子器件的制造
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Application No.: US10608718Application Date: 2003-06-27
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Publication No.: US07952190B2Publication Date: 2011-05-31
- Inventor: Richard D. Emery
- Applicant: Richard D. Emery
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A method and apparatus for fabrication of microelectronic devices are shown. In an embodiment of the invention, a microelectronic device comprises a die, the die comprising a first side, a second side, and an edge; a first plate, the first plate coupled with the die; and a package, the die being coupled with the package.
Public/Granted literature
- US20040262748A1 Fabrication of microelectronic devices Public/Granted day:2004-12-30
Information query
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