Invention Grant
US07952206B2 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
有权
因此，用于倒装芯片半导体器件的焊接凸块结构及其制造方法
- Patent Title: Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
- Patent Title (中): 因此，用于倒装芯片半导体器件的焊接凸块结构及其制造方法
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Application No.: US11459249Application Date: 2006-07-21
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Publication No.: US07952206B2Publication Date: 2011-05-31
- Inventor: Mark A. Bachman , Donald S. Bitting , Sailesh Chittipeddi , Seung H. Kang , Sailesh M. Merchant
- Applicant: Mark A. Bachman , Donald S. Bitting , Sailesh Chittipeddi , Seung H. Kang , Sailesh M. Merchant
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
Public/Granted literature
- US20070069394A1 SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE Public/Granted day:2007-03-29
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