Invention Grant
- Patent Title: Wafer grounding method for electrostatic clamps
- Patent Title (中): 用于静电夹的晶圆接地方法
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Application No.: US12262399Application Date: 2008-10-31
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Publication No.: US07952851B2Publication Date: 2011-05-31
- Inventor: Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
- Applicant: Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
- Applicant Address: US MA Beverly
- Assignee: Axcelis Technologies, Inc.
- Current Assignee: Axcelis Technologies, Inc.
- Current Assignee Address: US MA Beverly
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.
Public/Granted literature
- US20100110603A1 WAFER GROUNDING METHOD FOR ELECTROSTATIC CLAMPS Public/Granted day:2010-05-06
Information query
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