Invention Grant
- Patent Title: Motherboard module
- Patent Title (中): 主板模块
-
Application No.: US12493072Application Date: 2009-06-26
-
Publication No.: US07952864B2Publication Date: 2011-05-31
- Inventor: Shi-Feng Wang , Yong-Liang Hu , Ji-Peng Xu , Tsai-Kuei Cheng
- Applicant: Shi-Feng Wang , Yong-Liang Hu , Ji-Peng Xu , Tsai-Kuei Cheng
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: J.C. Patents
- Priority: TW98112019A 20090410
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A motherboard module adapted for connecting pluggably to a case includes a tray, a motherboard, a hard disk cage, and at least one hard disk drive. The tray has a bottom board, a plurality of fixing portions, and a front board. The front board is disposed at a side of the bottom board. The motherboard is disposed on the bottom board. The hard disk cage is fixedly connected to the fixing portions and above the tray, and has a hole corresponding to a hole of the front board. The hard disk drive may be disposed pluggably in the cage.
Public/Granted literature
- US20100259884A1 MOTHERBOARD MODULE Public/Granted day:2010-10-14
Information query