Invention Grant
- Patent Title: Thermal-electrical assembly for a portable communication device
- Patent Title (中): 用于便携式通信设备的热电组件
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Application No.: US12415881Application Date: 2009-03-31
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Publication No.: US07952881B2Publication Date: 2011-05-31
- Inventor: Salvador P. Magana , Dennis A. Byk , Sean C. Cadogan , Charles E. Kline , Arthur E. Petela , Sanjay K. Roy
- Applicant: Salvador P. Magana , Dennis A. Byk , Sean C. Cadogan , Charles E. Kline , Arthur E. Petela , Sanjay K. Roy
- Applicant Address: US IL Schaumburg
- Assignee: Motorola Solutions, Inc.
- Current Assignee: Motorola Solutions, Inc.
- Current Assignee Address: US IL Schaumburg
- Agent Barbara R. Doutre
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00

Abstract:
A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.
Public/Granted literature
- US20100246137A1 THERMAL-ELECTRICAL ASSEMBLY FOR A PORTABLE COMMUNICATION DEVICE Public/Granted day:2010-09-30
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