Invention Grant
US07952904B2 Three-dimensional memory-based three-dimensional memory module 有权
三维内存三维内存模块

  • Patent Title: Three-dimensional memory-based three-dimensional memory module
  • Patent Title (中): 三维内存三维内存模块
  • Application No.: US12043128
    Application Date: 2008-03-05
  • Publication No.: US07952904B2
    Publication Date: 2011-05-31
  • Inventor: Guobiao Zhang
  • Applicant: Guobiao Zhang
  • Main IPC: G11C5/02
  • IPC: G11C5/02
Three-dimensional memory-based three-dimensional memory module
Abstract:
Three-dimensional-memory-based three-dimensional memory module (3D2-M2) is a three-dimensional memory module (3D-MM) comprising a plurality of three-dimensional mask-programmable memory (3D-mM) chips. It is an ultra-low-cost, ultra-large-capacity and small-form-factor memory module. By further incorporating a usage-control (UC) block, 3D2-M2 enables a pricing model more acceptable to consumers, i.e. the hardware is sold at a low initial selling price (ISP) and the user only pays for the selected usage(s).
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