Invention Grant
- Patent Title: Three-dimensional memory-based three-dimensional memory module
- Patent Title (中): 三维内存三维内存模块
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Application No.: US12043128Application Date: 2008-03-05
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Publication No.: US07952904B2Publication Date: 2011-05-31
- Inventor: Guobiao Zhang
- Applicant: Guobiao Zhang
- Main IPC: G11C5/02
- IPC: G11C5/02

Abstract:
Three-dimensional-memory-based three-dimensional memory module (3D2-M2) is a three-dimensional memory module (3D-MM) comprising a plurality of three-dimensional mask-programmable memory (3D-mM) chips. It is an ultra-low-cost, ultra-large-capacity and small-form-factor memory module. By further incorporating a usage-control (UC) block, 3D2-M2 enables a pricing model more acceptable to consumers, i.e. the hardware is sold at a low initial selling price (ISP) and the user only pays for the selected usage(s).
Public/Granted literature
- US20080159722A1 Three-Dimensional Memory-Based Three-Dimensional Memory Module Public/Granted day:2008-07-03
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