Invention Grant
- Patent Title: Microphone assembly
- Patent Title (中): 麦克风组合
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Application No.: US09893997Application Date: 2001-06-29
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Publication No.: US07953241B2Publication Date: 2011-05-31
- Inventor: Martin Bondo Jorgensen , Aart Zeger Van Halteren
- Applicant: Martin Bondo Jorgensen , Aart Zeger Van Halteren
- Applicant Address: NL Amsterdam
- Assignee: Sonion Nederland B.V.
- Current Assignee: Sonion Nederland B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A microphone assembly for mounting in an electronic communication device, and wherein the microphone assembly comprises one or more sound inlet port(s) with channels (7), and one or more microphone(s) inside a housing (1). One or more controlling means (5) are an integrated part of the microphone assembly, said controlling means comprising a sound inlet part (6) composing a button and being surrounded by a second casing part (8), the button being loaded by a spring (9). The housing (1) comprises a terminal (2) for grounding the microphone, a terminal (3) connected to e.g. a battery, and a terminal (4) for signalling out.
Public/Granted literature
- US20020009206A1 Microphone assembly Public/Granted day:2002-01-24
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